Description: Unpigmented two-part epoxide casting systems, cures at room temperature or slightly elevated temperatures, operates up to 150 Centigrade, high thermal conductivity, Shore D 91, useful for casting or encapsulation, available in cartridges, several colors available

Description: Low viscosity epoxide casting system with high thermal conductivity, casting and encapsulation applications, compressive strength >23,000 psi, Shore D 91, two-part epoxide that cures at room temperature, gel time 15 minutes, available in 400 ml cartridges

PD-4200 

Description: Structural adhesive, room temperature cure two-part epoxy –amine formulation, easy mix ratio of 1:2, superior tensile peel and adhesion, superior to major corporations structural adhesive, open time of 20 and 60 minutes available

JB-1110 

Description: Two-part mercaptan-epoxy formulation, flexible mixing ratio that can be modified +/- 20% without affecting properties, resists Skydrol in aerospace applications, open time can be varied from 5 to 75 minutes, Sandable in 30 to 150 minutes, can be filled with a variety of conductive and non-conductive fillers, useful temperature range from –55 to 125^o C
variable hardness’s and flexibilities possible

Description: Low viscosity two-part epoxide systems with elongations ca. 300%. Can cure at room temperature or at elevated temperatures