Description: Single component, 100 % solids, rapid thermally curable epoxide for bonding stainless steel, superior adhesion, tensile strength and toughness, can be screen onto substrate, gel and esd versions available,  functions extremely well on virtually all substrates including glass, metals and other plastics

Description: High viscosity version of HT-L7940V

Description: Single component thermal snap cure high temperature adhesive, useable to over 400 ^oF (~200 ^oC), rapidly cures at 120 to 150 ^oC, useful for bonding motor armatures into ferrite and bonding plastics, low water absorption

HT-JED-7940 

Description: Single component stable at room temperature, high temperature adhesive useful for JEDEC level 1 applications, can be used in electronics in lead-free solder application, stable to 260^oC, thermally cured