Description: Single component thermally cured silver filled epoxide, highly electrically conductive, screen coatable, no solvents present, flexible after curing, cures in several minutes, minimal shrinkage, can be used for shielding or traces etc. Filler levels and types can be varied. Thermal curing conditions as well as base resin system are also adjustable. Please call for further details

Description: Screen coatable UV curable silver filled ink, epoxide based, curable on polyester and polyimide by UV, conductivity in milliohm regime, no solvents (100% non-volatile) formulation, high loading level, flexible product after cure, can be used in conjunction with JT series and other flexible coatings. Filler loading and type can be varied

Description: Single component rapidly curing silver filled epoxide.  Highly electrically conductive via hole filler, thermally cures in minutes, virtually no shrinkage and voids, no solvents present, single component, squeegees easily into via. Dual curing mechanism to enhance planarization is feasible.  Low and high viscosity versions available to ensure the complete filling of high aspect-ratio holes.

Description: Two component electrically conductive epoxides. Base resin systems can be varied from 1% to over 250% elongation. Filler loading level and type can also be adjusted. Curing at room temperature or elevated temperatures