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Circuit board coatings
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HJ-H3292-DC
Description: A
dielectric adhesive/coating that functions as a stress
relief layer at the connection point of the rigid and
flexible portions of a rigid-flex circuit board. The
single component product is dispensed by syringe onto
the joint area and is dual curing. Once in place, the
bead is fixtured by exposure to a 365 nm light source,
avoiding unwanted flow during the final thermal cure
that occurs at temperatures above 130oC. The
cured epoxide demonstrates elongation of greater than
40% and a modulus of ca. 950 psi.
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ZC-1500
Description: Zif connector build up layer, excellent adhesion to untreated polyester, avoids lamination step by building up thickness on flex tab, superior flexibility, UV curable, no solvents present, minimal shrinkage,
100% solids |
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JT-7123
Description: Self degassing version of JT-7130, similar properties, high elongation, superior adhesion to polyimide and polyester, self-extinguishing, tensile strength > 1000 psi, UV curable epoxide,
100% solids
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HJ-3292
Description: Permanent plating mask,
100% solids, elongation 75%, extremely flexible, UV curable epoxide based product, screen coatable, excellent tensile properties, minimal shrinkage, low modulus,
especially useful for flex circuitry
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AS-8280
Description: Sprayable conformal coating, low viscosity, excellent flexibility, elongation > 10%, all epoxide formulation, low shrinkage,
100% solids
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XB-121A
Description: Permanent plating
mask, low viscosity, can be made thixotropic, rigid
system with excellent toughness, excellent tensile
properties, minimal shrinkage upon cure,100% solids
epoxide-based for excellent thermal stability |
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LM-1820
Description: Laser markable coating, UV curable black formulation,
no solvents, can be laser ablated to write letters/numbers on chips
and other surfaces |
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