Circuit board coatings
HJ-H3292-DC
Description: A dielectric adhesive/coating that functions as a stress relief layer at the connection point of the rigid and flexible portions of a rigid-flex circuit board. The single component product is dispensed by syringe onto the joint area and is dual curing. Once in place, the bead is fixtured by exposure to a 365 nm light source, avoiding unwanted flow during the final thermal cure that occurs at temperatures above 130oC. The cured epoxide demonstrates elongation of greater than 40% and a modulus of ca. 950 psi.
ZC-1500
Description: Zif connector build up layer, excellent adhesion to untreated polyester, avoids lamination step by building up thickness on flex tab, superior flexibility, UV curable, no solvents present, minimal shrinkage, 100% solids
JT-7123
Description: Self degassing version of JT-7130, similar properties, high elongation, superior adhesion to polyimide and polyester, self-extinguishing, tensile strength > 1000 psi, UV curable epoxide, 100% solids
HJ-3292
Description: Permanent plating mask, 100% solids, elongation 75%, extremely flexible, UV curable epoxide based product, screen coatable, excellent tensile properties, minimal shrinkage, low modulus, especially useful for flex circuitry
AS-8280
Description: Sprayable conformal coating, low viscosity, excellent flexibility, elongation > 10%, all epoxide formulation, low shrinkage, 100% solids
XB-121A
Description: Permanent plating mask, low viscosity, can be made thixotropic, rigid system with excellent toughness, excellent tensile properties, minimal shrinkage upon cure,100% solids epoxide-based for excellent thermal stability
LM-1820
Description: Laser markable coating, UV curable black formulation, no solvents, can be laser ablated to write letters/numbers on chips
Dome coatings/Optical coatings
DC-K1210I
Description: UV curable, low viscosity < 225 cps, hard surface after cure, epoxide based, 100% solids
OC-AT4199
Description: UV curable epoxide. Adheres well to polyacrylate. Used to enhance image and magnification, sprayable Thick films feasible, excellent clarity
DC-B7300C
Description: Clear soft coating after UV cure, good elongation, flexible, easily pourable, 100% solids
DC-C8686E
Description: Low viscosity, UV curable epoxide, good clarity, 100% solids. Useful for fiber-optic coating applications.
Dual cure & (B-stageable)
DP-M8310S
Description: Dual cure system, initial thermal cure gives a soft wax-like product, secondary UV cure gives hard rigid system that can be sanded, epoxide based product, no solvents in formulation, useful for mold-making and investing, burns off completely if desired
DP-F7375D
Description: Dual cure epoxide system, thixotropic, initial UV cure followed by secondary thermal cure at 135-165 oC, excellent for bonding fiberglass, moisture resistant
DP-H1500T
Description: Dual cure system, low viscosity, UV curable epoxide, secondary thermal cure in shadow areas at approximately 135-165 oC. Lower secondary temperature curing versions available
DP-DC0182
Description: Dual cure system, low viscosity, UV curable epoxide, secondary thermal cure in shadow areas at 100+ Centigrade, Shore D in UV cured area >80, shadow curing in non-exposed area, good tensile properties for rigid system. Other formulations can be prepared with UV/thermal dual cure, no solvents in formulation (100% non-volatile), extremely low shrinkage, superior adhesion to a variety of substrates
General Information and Services: Dual cure systems can be prepared from most of our 100% solids UV curable epoxides. Please contact us for further information as assistance
Electrically conductive
AG-2300 series
Description: Single component thermally cured silver filled epoxide, highly electrically conductive, screen coatable, no solvents present, flexible after curing, cures in several minutes, minimal shrinkage, can be used for shielding or traces etc. Filler levels and types can be varied. Thermal curing conditions as well as base resin system are also adjustable. Please call for further details
XB152 series
Description: Screen coatable UV curable silver filled ink, epoxide based, curable on polyester and polyimide by UV, conductivity in milliohm regime, no solvents (100% non-volatile) formulation, high loading level, flexible product after cure, can be used in conjunction with JT series and other flexible coatings. Filler loading and type can be varied
AG-1200 (LV, HV)
Description: Single component rapidly curing silver filled epoxide. Highly electrically conductive via hole filler, thermally cures in minutes, virtually no shrinkage and voids, no solvents present, single component, squeegees easily into via. Dual curing mechanism to enhance planarization is feasible. Low and high viscosity versions available to ensure the complete filling of high aspect-ratio holes.
AG-2200 series
Description: Two component electrically conductive epoxides. Base resin systems can be varied from 1% to over 250% elongation. Filler loading level and type can also be adjusted. Curing at room temperature or elevated temperatures
